大电流功率电感器系列
TU High Current Power Inductors
●Features: Mo air-space,MagMetic powder is full filled iMside. Low DCR,Lower Loss,Low profile package with Large CurreMt DesigM. MagMetic shielded coMstructioM for high deMsity board assembly. Good DC curreMt characteristics iM high frequeMcy aMd high tem
TI High Current Power Inductors
●Features: The products contain no Halogen Free and also suppotr Halogen Free products Excellent for power line DC-DC conversion applications Shielded construction Lowest DCR/uH, in this Package sice. Handle high transient current spikes without saturatio
TF High Current Power Inductors
●Features: The products contain no Halogen Free and also suppotr Halogen Free products Excellent for power line DC-DC conversion applications Shielded construction Lowest DCR/uH, in this Package sice. Handle high transient current spikes without saturatio
STPL SMD High Current Power Inductors
●Features: 1.Lowest height (3.0mm/max) in this package footprint. 2.Shielded construction. 3.Lowest DCR/µH, in this package size. 4.Handles high transient current spikes without saturation. 5.Ultra low buzz noise, due to composite construction. 6.Freque
STP SMD High Current Power Inductors
●Features: 1.Lowest height (3.0mm/max) in this package footprint. 2.Shielded construction. 3.Lowest DCR/µH, in this package size. 4.Handles high transient current spikes without saturation. 5.Ultra low buzz noise, due to composite construction. 6.Frequenc
STPI SMD High Current Power Inductors
●Features: 1.Lowest height (3.0mm/max) in this package footprint. 2.Shielded construction. 3.Lowest DCR/µH, in this package size. 4.Handles high transient current spikes without saturation. 5.Ultra low buzz noise, due to composite construction. 6.Frequenc
SMP SMD High Current Power Inductors
●Features: 1.Lowest height (3.0mm/max) in this package footprint. 2.Shielded construction. 3.Lowest DCR/µH, in this package size. 4.Handles high transient current spikes without saturation. 5.Ultra low buzz noise, due to composite construction. 6.Frequenc
